TVAF47
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Product details
Parameters
| Items | Standard | |
|---|---|---|
| Operating temperature range | -30℃ to+85℃ | |
| Electrical performance | Rating | 50mA. 12V DC |
| Insulation resistance | 100MΩ min. 100V DC | |
| Dielectric strength | 250V AC for 1min. | |
| Contact resistance | 100mΩ max | |
| Durability | Lifetime | 100,000 Cycles. |
| Mechanical performance | Operating force | F：200gf P：300gf |
| Travel | Plastic Stem：0.2±0.1mm Silicagel Stem：0.25±0.1mm | |
Reference drawing
Circuit diagram
P.C.B land dimension
Structural diagram
How to order
Online inquiry